It is essential that state of the art electronic products are matched by state of the art solutions to manufacture and verify quality. Today's Printed Circuit Boards contain Ball Grid Array and similar devices with joints not visible by standard visual inspection.
CT Production offers the finest solutions available, having invested in both X-ray and Ersascope visual inspection technology, with fully supporting rework systems and highly trained technicians.
X-Tek Hawk Xray: With 6000 x magnification at various angles, X-ray inspection confirms whether BGA and QFN devices are fitted and soldered correctly. It is powerful enough to see through any device on a PCB to inspect internals such as part defects or PCB inner layers, shorts, opens and other process defects which cannot be seen using other methods. It offers detailed analysis, including voids and can be programmed to run repeatable routines.
The ErsaScope inspection scope has an ultra low profile prism lens for optical viewing underneath devices such as BGAs to visually inspect solder joint quality. It can be focussed to view along a row of joints under a device, thus complementing X-ray analysis.
| Copyright © 2011 CT Production Ltd | Site Map | Contact Us | Terms & Conditions | Privacy Policy | Links |  |