X ray and Ersascope Inspection at CT Production

State of the art electronic products require state of the art solutions to manufacture. Printed Circuit Boards contain Ball Grid Array and similar devices with joints not visible by standard visual inspection.

CT Production has invested in X ray and Ersascope inspection systems, as well as supporting rework systems and trained technicians.

The X-Tek Hawk Xray can see through any device on a PCB to inspect connections, whether BGA, QFN, connector, PCB track or inner layer etc. It can rotate and view at an angle to enable detailed analysis, or be programmed to run repeatable routines.

The ErsaScope inspection scope has an ultra low profile prism lens for optical viewing underneath devices such as BGAs to inspect solder joint quality. It can be focussed to view along a row of joints under a device, thus complementing and confirming X ray analysis.

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