CT Production continually invests in some of the finest equipment available for Surface Mount PCB assembly offering speed with accuracy and flexibility.
Our Europlacer placement machines use rapid-change intelligent feeders and can handle components from 01005 resistors to ball grid array (BGA) fine pitch devices upto 70mm square.
All common PCB substrate materials are populated, including FR4, flexi, flexi-rigid, aluminium and PTFE.
Solder paste printing is a critical process, which our Sprint automatic stencil printers achieve accurately and consistently, with built-in automatic optical inspection for verification.
Solder paste reflow is carefully profiled and processed using BTU VIP98 7+7 zone convection ovens.
Our SMT PCB processes are fully supported by experienced IPC trained technicians, using finest and latest technology equipment for process set-up and verification.
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