Repair and rework of printed circuit board assemblies and electronic equipment requires a high degree of skill and appropriate facilities. For product upgrades, field repairs and rework of defects, our staff are trained to the appropriate IPC standards, together with equipment to find faults and correct them.
Inspection and test methods
Methods available at CT Production for finding defects include automatic optical inspection (AOI), Ersascope inspection for BGA, X-ray inspection and manual inspection. We also have an array of test facilities.
Rework methods available at CT Production include the following:
An Ersa IR550A BGA and fine pitch rework system with full vision alignment, process monitoring and computer control enables accurate positioning and heat profiling for removal and replacement of complex devices.
A JBC 6000 top of range rework system comprising a full range of tools for most situations.
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