 
The Ersa SMT/BGA Rework system allows for repeatable results when removing and replacing complex devices. The system has closed loop temperature and profile control for consistent results.
The Ersa Scope enables close visual inspection of solder joint quality under devices such as BGA and uBGA, which can be impossible using conventional methods.
CTP has been successfully populating PCBs with Ball Grid Array devices since 2001 and the new systems will be ready for use from September, complementing its BGA Production and X-Ray services | 
